Vertical 3D Memory Technologies (Betty Prince)
8922 р.
Автор(ы): Betty Prince;
Издатель: John Wiley & Sons Limited
ISBN: 978-1-118-76045-1
ID: SKU1871497
Добавлено: 30.12.2023
Цены
Цена от 8922 р. до 8922 р. в 1 магазинах
Магазин | Цена | Наличие |
---|---|---|
ЛитРес 5/5 | 8922 р. 11152 р. электронная книга | скачать фрагмент | |
Лабиринт 5/5 | ||
Читай-город 5/5 | ||
МАЙШОП 5/5 | Один из первых книжных интернет-магазинов, работающий с 2002 года | |
Описание
The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories, terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via connections now and remote links later. Key features: Presents a review of the status and trends in 3-dimensional vertical memory chip technologies. Extensively reviews advanced vertical memory chip technology and development Explores technology process routes and 3D chip integration in a single reference
Смотри также Характеристики.
Яндекс.Маркет
О книге
ISBN | 978-1-118-76045-1 |
Автор(ы) | Betty Prince |
Книги где автор: Betty Prince
Технические науки - издательство "John Wiley & Sons Limited"
Категория 7137 р. - 10706 р.